Basic small electronic component technology started with this through-hole form.
Surface Mount Technology or Surface Mount Device requires high skill of the operator, which we have mastered it.
Fine Pitch and Ball Grid Array (BGA) are very delicate work and requires machine soldering. We have partners with solder machine range from high quality to low cost, which are willing to support our prototype, small quantity production.
Design For Manufacturing (DFM) and Design For Test (DFT) is a key character of the design that will go into mass production for maximum yield and quality.
